邓明晰.三次谐波超声脉冲回波法对厚板的无损检测[J].,2004,23(1):42-47 |
三次谐波超声脉冲回波法对厚板的无损检测 |
Nondestructive testing of thick solid plates using third-harmonic ultrasonic echo |
|
中文摘要: |
在同一厚板表面的两个不同位置处分别进行超声回波脉冲测量,一处有细微裂纹而另一处无细微裂纹。实验结果表明,即使两个位置回波的基波频谱非常接近,但相应的三次谐波回波频谱仍存在较显著的区别,这一结果可望用于厚板具有微缺陷时的超声无损检测。 |
英文摘要: |
The ultrasonic pulse echo measurements are performed for the two different positions on the surface of a thick solid plate, where there are micro-flaws in one position and no micro-flaws in another one. The experiment results show that although the fundamental characteristics of the ultrasonic echo for the two different positions are almost the same, the corresponding third-harmonic ones may be of great difference. This result may be used in the ultrasonic nondestructive testing of thick solid plates with the micro-defects. |
DOI:10.11684/j.issn.1000-310X.2004.01.010 |
中文关键词: 回波 三次谐波 板材 无损检测 |
英文关键词: Echo Third-harmonic Plate material NDT |
基金项目: |
|
摘要点击次数: 2506 |
全文下载次数: 868 |
查看全文
查看/发表评论 下载PDF阅读器 |
关闭 |