文章摘要
半导体芯片热超声换能器设计与试验
Design and testing of thermal ultrasonic transducers for semiconductor chips
投稿时间:2025-04-16  修订日期:2025-05-26
中文摘要:
      压电换能器是芯片电子封装技术的电声转换器件。为解决传统超声键合压电换能器热压焊接质量差,焊接界面不牢固,焊接热敏感等问题,本文设计了一款能够同时具有一定温度和振幅的60kHz的倒装换能器,应用于半导体芯片的倒装键合工艺。利用SolidWorks软件建立了换能器三维模型,运用Ansys有限元分析软件,采用模态仿真分析方法对换能器的结构进行了优化,采用阻抗分析仪测量研制换能器的阻抗和频率特性,利用激光测振仪精确测量换能器的输出振幅。实验结果表明:在未施加外部加热的条件下,超声吸嘴焊头振幅达到2.64μm;当对倒装换能器变幅杆施加400℃ 加热时,超声吸嘴焊头工作温度升至160℃ 且振幅为2.09μm,为芯片的热超声键合技术提供了创新解决方案。
英文摘要:
      Piezoelectric transducer is an electro-acoustic conversion device for chip electronics packaging technology. In order to solve the traditional ultrasonic bonding piezoelectric transducer thermocompression welding quality is poor, the welding interface is not solid, welding thermal sensitivity and so on, we paper designs a 60kHz flip-flop transducer that can have a certain temperature and amplitude at the same time, which is applied to the flip-flop bonding process of semiconductor chips. Using SolidWorks software to establish a three-dimensional model of the transducer, the use of Ansys finite element analysis software, the use of modal simulation and analysis methods to optimize the structure of the transducer, the use of impedance analyzers to measure the development of the transducer's impedance and frequency characteristics, the use of laser vibrometer to accurately measure the output amplitude of the transducer. The experimental results show that the amplitude of the ultrasonic nozzle tip reaches 2.64 μm without external heating, and the working temperature of the ultrasonic nozzle tip rises to 160 ℃ and the amplitude is 2.09 μm when 400 ℃ heating is applied to the amplitude bar of the flip-flop transducer, which provides an innovative solution for the thermal ultrasonic bonding technology of chips.
DOI:
中文关键词: 压电换能器  结构设计  热振复合  模态仿真
英文关键词: Piezoelectric transducer  Structure design  Thermal vibration combination  Modal simulation
基金项目:国家自然科学基金(52175392)、深圳市技术研究项目(GJHZ20240218111802005)、深圳市基础研究项目(JCYJ20240813104803006)
作者单位邮编
文德松 桂林理工大学机械与控制工程学院 541004
王海雄* 桂林理工大学机械与控制工程学院 541004
李宇祥 哈尔滨工业大学(深圳)机电工程与自动化学院 
邹士鹏 哈科迪兆声波技术(深圳)有限公司 
易维杰 桂林理工大学机械与控制工程学院 
隆志力 哈尔滨工业大学(深圳)机电工程与自动化学院 
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