Page 13 - 《应用声学》2021年第5期

第 40 卷 第 5 期 Vol. 40, No. 5
2021 年 9 月 Journal of Applied Acoustics September, 2021

⋄ 综述 ⋄

超声显微检测技术在电子封装中的应用与发展

王 坤 1,2 冷 涛 1† 毛 捷 1,2 廉国选 1

(1 中国科学院声学研究所 声场声信息国家重点实验室 北京 100190)

(2 中国科学院大学 北京 100049)
摘要：超声显微检测技术应用于电子封装领域始于 20 世纪 80 年代，如今已是检测电子封装可靠性和完整性
的重要手段，被广泛应用到了电子封装的缺陷检测和精密测量等方面。针对电子封装的超声显微检测存在回
波重叠、信噪比低等问题，近年来，发展了许多时频分析方法，用于获得优于常规方法的纵向分辨率，即实现超
分辨率。该文首先介绍了超声显微检测的发展历史，对其检测原理和分辨率理论进行了简述；其次，综述了超
声显微检测技术在电子封装中的主要应用与发展现状；然后，对超声显微检测的超分辨率成像方法进行了综
述，分别介绍了基于小波分析的反卷积、连续小波变换和稀疏表示在实现超分辨率时的原理及适用场景；最后，
探讨归纳了电子封装超声显微检测的主要研究方向及难点。
关键词：超声显微检测；电子封装；超分辨率；稀疏表示
中图法分类号: O426.9 文献标识码: A 文章编号: 1000-310X(2021)05-0657-11
DOI: 10.11684/j.issn.1000-310X.2021.05.002

Application and development of scanning acoustic microscopy testing

technology in electronic packaging

WANG Kun 1,2 LENG Tao 1 MAO Jie 1,2 LIAN Guoxuan 1

(1 State Key Laboratory of Acoustics, Institute of Acoustics, Chinese Academy of Sciences, Beijing 100190, China)
(2 University of Chinese Academy of Sciences, Beijing 100049, China)

Abstract: The application of scanning acoustic microscopy testing technology in the field of electronic pack-
aging began in the 1980s. It is now an important means of testing the reliability and integrity of electronic
packaging, and has been widely used in defect detection and precision measurement of electronic packaging. In
view of the problems of echo overlap and low signal-to-noise ratio in the scanning acoustic microscopy testing
of electronic packaging, many time-frequency analysis methods have been developed in recent years to obtain
axial resolution, which is superior to conventional methods, that is, to achieve super-resolution. In this paper,
the development history of scanning acoustic microscopy testing is introduced, and its detection principle and
resolution theory are briefly described. Secondly, the main application and development status of scanning
acoustic microscopy testing technology in electronic packaging are summarized. Then, the super-resolution
imaging methods of scanning acoustic microscopy testing are summarized, and the principles and applicable
scenarios of wavelet analysis based deconvolution, continuous wavelet transform and sparse signal represen-
tation in achieving super-resolution are introduced. Finally, the main research directions and difficulties of
scanning acoustic microscopy testing of electronic packaging are discussed and summarized.
Keywords: Scanning acoustic microscopy testing; Electronic packaging; Super-resolution; Sparse signal
representation

2020-11-09 收稿; 2021-01-24 定稿
作者简介: 王坤 (1994– ), 男, 河南商丘人, 博士研究生, 研究方向: 信号与信息处理。
† 通信作者 E-mail: lengtao@mail.ioa.ac.cn